Apparatus and methods for assembling a display area

ABSTRACT

A method of assembling a display area includes selecting a first tile from a plurality of tiles, each tile of the plurality of tiles includes a predetermined parameter and a plurality of microLEDs defining a plurality of pixels. The selecting the first tile based on a value of the predetermined parameter of the first tile. The method includes selecting a second tile from the plurality of tiles based on a value of the predetermined parameter of the second tile. The method further includes positioning the first tile and the second tile into an array defining at least a portion of the display area. A first edge of the first tile facing a second edge of the second tile. A display device including the display area assembled by the method is also provided.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority of U.S. ProvisionalApplication Ser. No. 62/583,020 filed on Nov. 8, 2017 the contents ofwhich are relied upon and incorporated herein by reference in theirentirety as if fully set forth below.

FIELD

The present disclosure relates generally to methods and apparatus forassembling a display area of a display device and, more particularly, tomethods and apparatus for positioning a plurality of tiles into an arraydefining at least a portion of the display area.

BACKGROUND

It is known to position a plurality of tiles into an array defining atleast a portion of a display area of a display device.

SUMMARY

The following presents a simplified summary of the disclosure to providea basic understanding of some embodiments described in the detaileddescription.

In some embodiments, a method of assembling a display area can includeselecting a first tile from a plurality of tiles. Each tile of theplurality of tiles can include a predetermined parameter and a pluralityof microLEDs defining a plurality of pixels. The selecting the firsttile can be based on a value of the predetermined parameter of the firsttile. The method can include selecting a second tile from the pluralityof tiles based on a value of the predetermined parameter of the secondtile. The method can include positioning the first tile and the secondtile into an array defining at least a portion of the display area. Afirst edge of the first tile can face a second edge of the second tile.

In some embodiments, the value of the predetermined parameter of thefirst tile can be greater than a nominal value of the predeterminedparameter, and the value of the predetermined parameter of the secondtile can be less than the nominal value of the predetermined parameter.

In some embodiments, the value of the predetermined parameter of thefirst tile can define a greatest value of the predetermined parametersof the plurality of tiles relative to a nominal value of thepredetermined parameter, and the value of the predetermined parameter ofthe second tile can define a smallest value of the predeterminedparameters of the plurality of tiles relative to the nominal value ofthe predetermined parameter.

In some embodiments, the method can further include sorting theplurality of tiles based on a respective value of the predeterminedparameter of the plurality of tiles.

In some embodiments, the sorting can include identifying a first set oftiles and a second set of tiles. The respective value of thepredetermined parameter of each tile of the first set of tiles can begreater than a nominal value of the predetermined parameter, and therespective value of the predetermined parameter of each tile of thesecond set of tiles can be less than the nominal value of thepredetermined parameter.

In some embodiments, the method can further include ordering the firstset of tiles in ascending order or descending order based on therespective value of the predetermined parameter of each tile of thefirst set of tiles, and ordering the second set of tiles in ascendingorder or descending order based on the respective value of thepredetermined parameter of each tile of the second set of tiles.

In some embodiments, the first tile can be selected from the first setof tiles and the second tile can be selected from the second set oftiles.

In some embodiments, the value of the predetermined parameter of thefirst tile can define a greatest value of the predetermined parametersof the first set of tiles relative to the nominal value of thepredetermined parameter, and the value of the predetermined parameter ofthe second tile can define a smallest value of the predeterminedparameters of the second set of tiles relative to the nominal value ofthe predetermined parameter.

In some embodiments, the method can further include selecting at leastone additional tile from the plurality of tiles based on a value of thepredetermined parameter of the at least one additional tile andpositioning the at least one additional tile into the array.

In some embodiments, the predetermined parameter of each tile of theplurality of tiles can include at least one of a respective lateraldimension of each tile of the plurality of tiles, a respective edgestraightness of each tile of the plurality of tiles, and a respectivesquareness of each tile of the plurality of tiles.

In some embodiments, a display device can include the display areaassembled by the method, and a lateral distance between immediatelyadjacent pixels of the plurality of pixels can define a pixel pitch. Alateral distance between at least one first outer pixel of the firsttile spaced from the first edge of the first tile and at least onesecond outer pixel of the second tile spaced from the second edge of thesecond tile can define a registration pitch, and the registration pitchcan be less than or equal to about 1.5 times the pixel pitch.

In some embodiments, the registration pitch can be less than or equal toabout 1.1 times the pixel pitch.

In some embodiments, the registration pitch can be less than or equal toabout 1.01 times the pixel pitch.

In some embodiments, the pixel pitch can be from about 100 micrometersto about 500 micrometers.

In some embodiments, a method of assembling a display area can includeselecting a plurality of pairs of tiles from a plurality of tiles. Eachtile of the plurality of tiles can include a predetermined parameter anda plurality of microLEDs defining a plurality of pixels. The selectingthe plurality of pairs of tiles can be based on a respective value ofthe predetermined parameter of each tile of the plurality of tiles. Eachpair of tiles can include a first tile and a second tile, the respectivevalue of the predetermined parameter of the first tile of each pair oftiles can be greater than the respective value of the predeterminedparameter of the second tile of each pair of tiles. The method canfurther include positioning the plurality of pairs of tiles into anarray defining at least a portion of the display area. A respectivefirst edge of the first tile of each pair of tiles can face a respectivesecond edge of the second tile of each pair of tiles.

In some embodiments, the respective value of the predetermined parameterof the first tile of each pair of tiles can be greater than a nominalvalue of the predetermined parameter, and the respective value of thepredetermined parameter of the second tile of each pair of tiles can beless than the nominal value of the predetermined parameter.

In some embodiments, the method can further include identifying a firstset of tiles from the plurality of tiles and identifying a second set oftiles from the plurality of tiles. The respective value of thepredetermined parameter of each tile of the first set of tiles can begreater than a nominal value of the predetermined parameter and therespective value of the predetermined parameter of each tile of thesecond set of tiles can be less than the nominal value of thepredetermined parameter. The first tile of each pair of tiles can beselected from the first set of tiles, and the second tile of each pairof tiles can be selected from the second set of tiles.

In some embodiments, the method can further include ordering the firstset of tiles in ascending order or descending order based on therespective value of the predetermined parameter of each tile of thefirst set of tiles, and ordering the second set of tiles in ascendingorder or descending order based on the respective value of thepredetermined parameter of each tile of the second set of tiles. Thefirst tile of each pair of tiles can be sequentially selected from thefirst set of ordered tiles and the second tile of each pair of tiles canbe sequentially selected from the second set of ordered tiles.

In some embodiments, the predetermined parameter of each tile of theplurality of tiles can include at least one of a respective lateraldimension of each tile of the plurality of tiles, a respective edgestraightness of each tile of the plurality of tiles, and a respectivesquareness of each tile of the plurality of tiles.

In some embodiments, a display device can include the display areaassembled by the method, and a lateral distance between immediatelyadjacent pixels of the plurality of pixels can define a pixel pitch fromabout 100 micrometers to about 500 micrometers.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, embodiments and advantages are betterunderstood when the following detailed description is read withreference to the accompanying drawings, in which:

FIG. 1 illustrates a schematic view of an exemplary embodiment of adisplay device including a display area including a plurality of tilesin accordance with embodiments of the disclosure;

FIG. 2 illustrates an enlarged view of a tile of the plurality of tilesof the display area as shown by view 2 of FIG. 1 in accordance withembodiments of the disclosure;

FIG. 3 illustrates an enlarged view of a portion of the tile as shown byview 3 of FIG. 2 including a plurality of microLEDs defining a pluralityof pixels in accordance with embodiments of the disclosure;

FIG. 4 shows a cross-sectional view of a pixel of the plurality ofpixels including at least one microLED of the plurality of microLEDstaken along line 4-4 of FIG. 3 in accordance with embodiments of thedisclosure;

FIG. 5 illustrates an exemplary method of assembling a display area inaccordance with embodiments of the disclosure;

FIG. 6 illustrates an exemplary plot based on a simulated assembly ofdisplay areas including a plurality of 50 micrometer offset tiles fordifferent tile cutting techniques in accordance with embodiments of thedisclosure, where the vertical or “Y” axis represents failure rate inpercentage (%) and the horizontal or “X” axis represents pixel pitch inmicrometers (μm);

FIG. 7 illustrates an exemplary plot based on a simulated assembly ofdisplay areas including a plurality of 100 micrometer offset tiles fordifferent tile cutting techniques in accordance with embodiments of thedisclosure, where the vertical or “Y” axis represents failure rate inpercentage (%) and the horizontal or “X” axis represents pixel pitch inmicrometers (μm);

FIG. 8 illustrates an exemplary plot based on a simulated assembly ofdisplay areas including a plurality of 50 micrometer offset tiles withglobal positioning tolerance for different registration pitches andpositioning strategies in accordance with embodiments of the disclosure,where the vertical or “Y” axis represents failure rate in percentage (%)and the horizontal or “X” axis represents display area size in number oftiles in an array (n×m);

FIG. 9 illustrates an exemplary plot based on a simulated assembly ofdisplay areas including a plurality of 50 micrometer offset tiles withrelative positioning tolerance for different registration pitches andpositioning strategies in accordance with embodiments of the disclosure,where the vertical or “Y” axis represents failure rate in percentage (%)and the horizontal or “X” axis represents display area size in number oftiles in an array (n×m);

FIG. 10 illustrates an exemplary plot based on a simulated assembly ofdisplay areas including a plurality of 100 micrometer offset tiles withglobal positioning tolerance for different registration pitches andpositioning strategies in accordance with embodiments of the disclosure,where the vertical or “Y” axis represents failure rate in percentage (%)and the horizontal or “X” axis represents display area size in number oftiles in an array (n×m); and

FIG. 11 illustrates an exemplary plot based on a simulated assembly ofdisplay areas including a plurality of 100 micrometer offset tiles withrelative positioning tolerance for different registration pitches andpositioning strategies in accordance with embodiments of the disclosure,where the vertical or “Y” axis represents failure rate in percentage (%)and the horizontal or “X” axis represents display area size in number oftiles in an array (n×m).

DETAILED DESCRIPTION

Embodiments will now be described more fully hereinafter with referenceto the accompanying drawings in which example embodiments are shown.Whenever possible, the same reference numerals are used throughout thedrawings to refer to the same or like parts. However, this disclosuremay be embodied in many different forms and should not be construed aslimited to the embodiments set forth herein.

It is to be understood that specific embodiments disclosed herein areintended to be exemplary and therefore non-limiting. For purposes of thedisclosure, FIG. 1 illustrates a schematic view of an exemplary displaydevice 100 including a plurality of tiles 105. In some embodiments, theplurality of tiles 105 can be positioned into an array (e.g. an n×marray) defining a display area 101 of the display device 100. In someembodiments, the display device 100 can be employed in one or moreapplications including, but not limited to, mobile devices, wearables(e.g., watches), televisions, automotive displays, transparent displays,signage, computers, tablets, and other display monitors where a user mayview and/or interact with (e.g., touch, contact) the display area 101 ofthe display device 100. Additionally, in some embodiments, the displaydevice 100 can be employed in a direct-view display (e.g., MicroLEDdisplay). Moreover, in some embodiments. the display device 100 can beintegrated into a display (e.g., LCD display) and employed as abacklight unit.

Additionally, although illustrated as a planar, rectangular display area101 including a 5×5 (n×m) array, in some embodiments, the display area101 can include a variety of shapes, sizes, and planarity including, butnot limited to circular, elliptical, and other geometric and polygonalshapes, in any number of n×m arrays, defining a planar or non-planardisplay area 101, without departing from the scope of the disclosure. Insome embodiments, the display area 101 can include symmetric orasymmetric, as well as regular or irregular shapes achieved by one ormore tiling methods in accordance with embodiments of the disclosure.Likewise, although illustrated as planar, rectangular tiles, in someembodiments, one or more tiles of the plurality of tiles 105 can includea variety of shapes, sizes, and planarity including, but not limited totriangular, and other geometric and polygonal shapes, in any size (e.g.,dimension) including symmetric or asymmetric tiles, as well as regularor irregular shapes defining a planar or non-planar tile, withoutdeparting from the scope of the disclosure.

In some embodiments, by assembling the display area 101 with theplurality of tiles 105, in the event one or more tiles of the pluralityof tiles 105 is determined to be defective (e.g., faulty electricalwiring, broken, malfunctioning), the one or more defective tiles can beremoved from the n×m array and at least one of repaired and replaced.Alternatively, if the display area 101 was provided as a single,relatively larger tile as compared to a plurality of relatively smallertiles, in the event the single, relatively larger tile was determined tobe defective, the entire display would be defective. Thus, in someembodiments, by providing the display area 101 as a plurality of tiles105 assembled into an n×m array, costs, time, and waste associated withproviding the display area 101 of the display device 100 can be reducedand assembly of the display area 101 can be performed more efficiently.

FIG. 2 illustrates an enlarged view of a tile 105 ij of the plurality oftiles 105 as shown by view 2 of FIG. 1, where the tile 105 ij can berepresentative of one or more individual tiles of the plurality of tiles105 positioned into the (n×m) array defining the display area 101 of thedisplay device 100. A nominal tile 200, shown in a dashed outline, canbe representative of a nominal (e.g., desired, intended) profile of thetile 105 ij. Additionally, as illustrated in FIG. 2 and as discussedmore fully below, in some embodiments, features of the tile 105 ij maydeviate from features of the nominal tile 200 based at least on thetechnique employed to cut the tile 105 ij including accuracy, precision,and tolerances of the cutting technique. If the cutting technique couldreliably provide each tile of the plurality of tiles 105 with thefeatures of the nominal tile 200, positioning of the plurality of tiles105 into the n×m array could be accomplished without consideration ofdeviations from the nominal features. However, because at least thetechnique employed to cut the tile 105 ij including accuracy, precision,and tolerances of the cutting technique can, in some embodiments,provide features of the tile 105 ij that deviate from features of thenominal tile 200, such deviations may be considered, in someembodiments, when assembling the plurality of tiles 105 into the n×marray.

For example, in some embodiments, the tile 105 ij can include apredetermined parameter including at least one of a respective lateraldimension of the tile 105 ij, a respective edge straightness of the tile105 ij, and a respective squareness of the tile 105 ij. In someembodiments, the predetermined parameter can be based on one or more ofa direct measurement of a feature of the tile 105 ij, a numericaldistribution of the predetermined parameter of the tile 105 ij, and anumerical distribution of predetermined parameters of statisticallysimilar tiles. Additionally, in some embodiments, the predeterminedparameter can be based on a predetermined range relative to a nominalvalue, where, for example, one or more tiles including a predeterminedparameter within 6-sigma or 3-sigma of the nominal value can beselected.

In some embodiments, a value of the predetermined parameter of the tile105 ij can include a first lateral dimension D1 (e.g., an averagelateral dimension) between a first edge 201 of the tile 105 ij and anopposing second edge 202 of the tile 105 ij. Likewise, in someembodiments, a value of the predetermined parameter of the tile 105 ijcan include a second lateral dimension D2 (e.g., an average lateraldimension) between a third edge 203 of the tile 105 ij and an opposingfourth edge 204 of the tile 105 ij. In some embodiments, a value of thepredetermined parameter of the tile 105 ij can include a firststraightness D5 of the first edge 201 of the tile 105 ij defined betweena maximum location 201 a of the first edge 201 relative to the firstlateral dimension D1 and a minimum location 201 b of the first edge 201relative to the first lateral dimension D1. In some embodiments, a valueof the predetermined parameter of the tile 105 ij can include a secondstraightness D6 of the second edge 202 of the tile 105 ij definedbetween a maximum location 202 a of the second edge 202 relative to thefirst lateral dimension D1 and a minimum location 202 b of the secondedge 202 relative to the first lateral dimension D1. In someembodiments, a value of the predetermined parameter of the tile 105 ijcan include a third straightness D7 of the third edge 203 of the tile105 ij defined between a maximum location 203 a of the third edge 203relative to the second lateral dimension D2 and a minimum location 203 bof the third edge 203 relative to the second lateral dimension D2.Likewise, in some embodiments, a value of the predetermined parameter ofthe tile 105 ij can include a fourth straightness D8 of the fourth edge204 of the tile 105 ij defined between a maximum location 204 a of thefourth edge 204 relative to the second lateral dimension D2 and aminimum location 204 b of the fourth edge 204 relative to the secondlateral dimension D2.

Additionally, in some embodiments, a value of the predeterminedparameter of the tile 105 ij can include a squareness of the tile 105 ijdefined as a difference between a first diagonal dimension D3 of thetile 105 ij and a second diagonal dimension D4 of the tile 105 ij. Insome embodiments, the first diagonal dimension D3 can be defined as adistance between a first corner 205 of the tile 105 ij located at anintersection of the first edge 201 and the third edge 203 and a secondcorner 206 of the tile 105 ij located at an intersection of the secondedge 202 and the fourth edge 204. Likewise, in some embodiments, thesecond diagonal dimension D4 can be defined as a distance between athird corner 207 of the tile 105 ij located at an intersection of thesecond edge 202 and the third edge 203 and a fourth corner 208 of thetile 105 ij located at an intersection of the first edge 201 and thefourth edge 204. In some embodiments, the squareness parameter can bedefined as a measure of how one or more corners of the tile 105 ijcompare to one or more respective corners of the nominal tile 200. Forexample, in some embodiments, one or more corners of the nominal tile200 can include an angle of 90 degrees (e.g., rectangular), and thesquareness parameter can compare how the respective angle of one or morecorners of the tile 105 ij compares to the angle of 90 degrees.Additionally, in some embodiments, one or more corners of the nominaltile 200 can include a non 90 degree angle, and the squareness parametercan compare how the respective angle of one or more corners of the tile105 ij compares to the non 90 degree angle.

FIG. 3 illustrates an enlarged view of a portion of the tile 105 ij asshown by view 3 of FIG. 2 including a plurality of micrometer-sizedlight emitting diodes (microLEDs) 300 defining a plurality of pixels305. For clarity purposes, a glass or film 401 (See FIG. 4) and asubstrate 402 (See FIG. 4) are not illustrated in FIG. 3. In someembodiments, a lateral distance “px” and/or “py” between immediatelyadjacent pixels of the plurality of pixels 305 can define a pixel pitch.In some embodiments, px can equal py, and in some embodiments, px can bedifferent than py. In some embodiments, at least one of the pixel pitch(px, py) can be from about 50 micrometers to about 1000 micrometers,including all ranges and subranges therebetween. For example, in someembodiments, at least one of the pixel pitch (px, py) can be from about100 micrometers to about 200 micrometers, from about 100 micrometers toabout 300 micrometers, from about 100 micrometers to about 400micrometers, from about 100 micrometers to about 500 micrometers, fromabout 500 micrometers to about 600 micrometers, from about 600micrometers to about 700 micrometers, from about 700 micrometers toabout 800 micrometers, from about 800 micrometers to about 900micrometers, from about 900 micrometers to about 1000 micrometers. Insome embodiments, at least one of the pixel pitch (px, py) can be lessthan 50 micrometers, for example, from about 0 micrometers to about 50micrometers, including all ranges and subranges therebetween, or greaterthan 1000 micrometers, for example, from about 1 millimeter to about 3millimeters, including all ranges and subranges therebetween.

In some embodiments, the nominal tile 200 can include a first lateraldimension D1 within a range of from about 10 mm to about 100 cm,including all ranges and subranges therebetween, and a second lateraldimension D2 within a range of from about 10 mm to about 100 cm,including all ranges and subranges therebetween. In some embodiments,the first lateral dimension D1 and the second lateral dimension D2 canbe selected based on the particular application in which the displaydevice including the display area may be employed. For example, turningback to FIG. 2, in an exemplary embodiment, the nominal tile 200 caninclude a first lateral dimension D1 of about 100.44 mm and a secondlateral dimension D2 of about 178.56 mm, as provided in TABLE 1.Additionally, with respect to the nominal tile, D3 can equal D4, and thesquareness (D3−D4) can, therefore, equal zero. Likewise, with respect tothe nominal tile 200, the edge straightness (D5, D6, D7, D8) can equalzero.

TABLE 1 Nominal Tile Value [mm] D1 100.44 D2 178.56 D3-D4 0 D5, D6, D7,D8 0

Additionally, TABLE 2 provides a respective number of pixels per eachtile for the indicated pixel pitches of from 50 micrometers to 500micrometers (where px equals py) for the nominal tile 200 including thefirst lateral dimension D1 of about 100.44 mm and the second lateraldimension D2 of about 178.56 mm.

TABLE 2 Pixel Pitch [um] Pixels/Tile 50 7173827 100 1793457 150 797092200 448364 250 286953 300 199273 350 146405 400 112091 450 88566 50071738

Moreover, turning back to FIG. 1, for the nominal tile 200 including thefirst lateral dimension D1 of about 100.44 mm and the second lateraldimension D2 of about 178.56 mm, TABLE 3 provides the nominal (n)dimension, the nominal (m) dimension, and the corresponding diagonaldimension of the display area 101 for respective n×m arrays.

TABLE 3 (n) Dimension (m) Dimension Display Diagonal Array [mm] [mm][mm] 5 × 5 502.20 892.80 1023.62 6 × 6 602.64 1071.36 1229.36 7 × 7703.08 1249.92 1435.10 8 × 8 803.52 1428.48 1638.30 9 × 9 903.96 1607.041844.04 10 × 10 1004.40 1785.60 2049.78

FIG. 4 shows a cross-sectional view of a pixel 305 xy of the pluralityof pixels 305 taken along line 4-4 of FIG. 3, where the pixel 305 xy canbe representative of one or more individual pixels of the plurality ofpixels 305 including the plurality of microLEDs 300. In someembodiments, the pixel 305 xy can include three microLEDs (e.g., a firstmicroLED 405 a, a second microLED 405 b, a third microLED 405 c) thatdefine the pixel 305 xy. For example, in some embodiments, one of themicroLEDs (e.g., first microLED 405 a) can include a red microLED,another one of the microLEDs (e.g., second microLED 405 b) can include agreen microLED, and another one of the microLEDs (e.g., third microLED405 c) can include a blue microLED. Additionally, in some embodiments,the first microLED 405 a can include a first electrode 403 a to controlan operation of the first microLED 405 a, the second microLED 405 b caninclude a second electrode 403 b to control an operation of the secondmicroLED 405 b, and the third microLED 405 c can include a thirdelectrode 403 c to control an operation of the third microLED 405 c. Insome embodiments, the pixel 305 xy can include additional elements andcomponents (e.g., thin film transistors) for electrically controllingand operating the microLEDs 405 a, 405 b, 405 c. In some embodiments,each microLED 405 a, 405 b, 405 c can include a dimension defining alight emitting region of from about 10 micrometers to about 200micrometers, including all ranges and subranges therebetween. Forexample, in some embodiments, each microLED 405 a, 405 b, 405 c caninclude a dimension defining a light emitting region of from about 10micrometers to about 20 micrometers, from about 10 micrometers to about50 micrometers, from about 50 micrometers to about 100 micrometers, fromabout 100 micrometers to about 200 micrometers.

Moreover, in some embodiments, the first microLED 405 a, the secondmicroLED 405 b, the third microLED 405 c, and the respective firstelectrode 403 a, second electrode 403 b, and third electrode 403 c canbe connected to a substrate 402. In some embodiments, a glass or film401 can be provided opposite the substrate 402 with the microLEDs 405 a,405 b, 405 c and the electrodes 403 a, 403 b, 403 c positioned betweenthe glass or film 401 and the substrate 402. In some embodiments, bycontrolling, for example, an electrical current supplied to each of therespective red, green, and blue microLEDs 405 a, 405 b, 405 c with therespective electrodes 403 a, 403 b, 403 c, the pixel 305 xy can providea broad color spectrum of visible light based on additive color mixing.In some embodiments, the pixel 305 xy can include a single microLED formonochrome emission, where a color display can be achieved through colorconversion. Likewise, in some embodiments, the pixel 305 xy can includea single microLED provided as a multi-color LED, one or more blue orwhite LEDs provided with color filters, or other semiconductor lightsources provided as a micro-sized diode to emit light in accordance withembodiments of the disclosure, without departing from the scope of thedisclosure. Additionally, in some embodiments, microLEDs can providelower power consumption and higher contrast ratio than, for example,standard light emitting diodes (LEDs) and liquid crystal displays (LCDs)as well as longer lifetime operability than, for example, organic lightemitting diodes (OLEDs).

Turning back to FIG. 2, and with reference to TABLES 4-23, a pluralityof tiles were cut based on nominal dimensions of TABLE 1 using fourdifferent cutting techniques. Additionally, corresponding predeterminedparameters (e.g., D1-D8) of each tile were measured and recorded.Deviations of the measured values of the predetermined parametersrelative to the nominal values of the predetermined parameters can beattributed, in some embodiments, to accuracy, precision, and tolerancesof each respective cutting technique. Additionally, in some embodiments,two or more different cutting techniques can be employed to cut one ormore edges of each tile of the plurality of tiles.

For example, a first cutting technique (Cutting Technique 1) wasemployed using a standard semiconductor dicing saw to cut 56 tiles.TABLES 4-8 provide measured values and a corresponding frequency of thepredetermined parameters of each tile cut by Cutting Technique 1. Insome embodiments, where the total frequency of tiles differs from the 56tiles cut using Cutting Technique 1, it is to be understood that theparticular measurement may be omitted based at least on an error ordiscrepancy, where such omission is deemed to not alter the statisticalsignificance of the measured values. In particular, TABLE 4 providesmeasured values of the first lateral dimension D1 and the correspondingfrequency of the measured values of the plurality of tiles cut withCutting Technique 1.

TABLE 4 Cutting Technique 1 D1 [mm] freq 99.999 1 100.000 3 100.001 3100.002 1 100.004 2 100.005 2 100.006 4 100.007 2 100.008 5 100.009 3100.010 6 100.011 2 100.012 6 100.013 2 100.014 4 100.015 4 100.016 1100.017 2 100.019 2 100.023 1

TABLE 5 provides measured values of the second lateral dimension D2 andthe corresponding frequency of the measured values of the plurality oftiles cut with Cutting Technique 1.

TABLE 5 Cutting Technique 1 D2 [mm] freq 180.400 5 180.402 6 180.404 1180.406 4 180.408 6 180.410 10 180.412 9 180.414 8 180.416 3 180.418 1180.420 2 180.428 1

TABLE 6 provides measured values of the squareness (D3−D4) and thecorresponding frequency of the measured values of the plurality of tilescut with Cutting Technique 1.

TABLE 6 Cutting Technique 1 Squareness [mm] freq 0.00000 1 0.00025 20.00050 1 0.00075 5 0.00100 2 0.00125 3 0.00150 5 0.00175 2 0.00200 40.00225 6 0.00250 2 0.00275 3 0.00300 4 0.00325 5 0.00350 1 0.00375 30.00400 2 0.00425 1 0.00475 1 0.00550 2 0.00600 1

TABLE 7 provides measured values of the straightness (D5, D6) relativeto the first lateral dimension D1 and the corresponding frequency of themeasured values of the plurality of tiles cut with Cutting Technique 1.

TABLE 7 Cutting Technique 1 Straightness D1 [mm] freq 0.004 1 0.005 70.006 13 0.007 14 0.008 16 0.009 16 0.010 6 0.011 8 0.012 6 0.013 60.014 7 0.015 1 0.016 4 0.017 2 0.021 1 0.022 1 0.025 1 0.027 1 0.029 1

TABLE 8 provides measured values of the straightness (D7, D8) relativeto the second lateral dimension D2 and the corresponding frequency ofthe measured values of the plurality of tiles cut with Cutting Technique1.

TABLE 8 Cutting Technique 1 Straightness D2 [mm] freq 0.002 1 0.003 250.004 22 0.005 22 0.006 11 0.007 9 0.008 7 0.009 4 0.010 1 0.011 4 0.0122 0.015 1 0.019 1 0.022 1

A second cutting technique (Cutting Technique 2) was employed using aMP500 precision mechanical scribe manufactured by MDI AdvancedProcessing to cut 52 tiles. TABLES 9-13 provide measured values of thepredetermined parameters of each tile cut by Cutting Technique 2. Insome embodiments, where the total frequency of tiles differs from the 52tiles cut using Cutting Technique 2, it is to be understood that theparticular measurement may be omitted based at least on an error ordiscrepancy, where such omission is deemed to not alter the statisticalsignificance of the measured values. In particular, TABLE 9 providesmeasured values of the first lateral dimension D1 and the correspondingfrequency of the measured values of the plurality of tiles cut withCutting Technique 2.

TABLE 9 Cutting Technique 2 D1 [mm] freq 100.0045 1 100.0050 1 100.00551 100.0060 3 100.0065 6 100.0070 6 100.0075 5 100.0080 2 100.0085 5100.0090 5 100.0095 3 100.0100 3 100.0105 3 100.0120 1 100.0125 3100.0150 2 100.0165 1

TABLE 10 provides measured values of the second lateral dimension D2 andthe corresponding frequency of the measured values of the plurality oftiles cut with Cutting Technique 2.

TABLE 10 Cutting Technique 2 D2 [mm] freq 179.998 1 180.006 1 180.008 4180.010 2 180.012 4 180.014 8 180.016 7 180.018 8 180.020 1 180.022 5180.024 1 180.026 4 180.028 1 180.030 2 180.032 1 180.040 1

TABLE 11 provides measured values of the squareness (D3−D4) and thecorresponding frequency of the measured values of the plurality of tilescut with Cutting Technique 2.

TABLE 11 Cutting Technique 2 Squareness [mm] freq 0.001 4 0.003 2 0.0043 0.005 4 0.006 8 0.007 7 0.008 8 0.010 5 0.011 6 0.012 2 0.013 1 0.0181

TABLE 12 provides measured values of the straightness (D5, D6) relativeto the first lateral dimension D1 and the corresponding frequency of themeasured values of the plurality of tiles cut with Cutting Technique 2.

TABLE 12 Cutting Technique 2 Straightness D1 [mm] freq 0.008 8 0.012 390.016 20 0.020 11 0.024 11 0.028 5 0.032 1 0.040 2 0.044 3 0.068 1 0.0721 0.084 1

TABLE 13 provides measured values of the straightness (D7, D8) relativeto the second lateral dimension D2 and the corresponding frequency ofthe measured values of the plurality of tiles cut with Cutting Technique2.

TABLE 13 Cutting Technique 2 Straightness D2 [mm] freq 0.0075 15 0.010026 0.0125 19 0.0150 12 0.0175  8 0.0200 10 0.0225  4 0.0250  2 0.0275  30.0300  1 0.0375  1 0.0425  1 0.0450  1

A third cutting technique (Cutting Technique 3) was employed using anon-diffracting beam CLT Laser cutting process to cut 41 tiles. TABLES14-18 provide measured values of the predetermined parameters of eachtile cut by Cutting Technique 3. In some embodiments, where the totalfrequency of tiles differs from the 41 tiles cut using Cutting Technique3, it is to be understood that the particular measurement may be omittedbased at least on an error or discrepancy, where such omission is deemedto not alter the statistical significance of the measured values. Inparticular, TABLE 14 provides measured values of the first lateraldimension D1 and the corresponding frequency of the measured values ofthe plurality of tiles cut with Cutting Technique 3.

TABLE 14 Cutting Technique 3 D1 [mm] freq 100.0070 1 100.0074 1 100.00761 100.0078 1 100.0080 1 100.0082 4 100.0084 2 100.0086 4 100.0088 2100.0090 3 100.0092 4 100.0094 4 100.0096 3 100.0098 1 100.0100 1100.0102 2 100.0106 2 100.0110 1 100.0112 1 100.0114 1 100.0116 1

TABLE 15 provides measured values of the second lateral dimension D2 andthe corresponding frequency of the measured values of the plurality oftiles cut with Cutting Technique 3.

TABLE 15 Cutting Technique 3 D2 [mm] freq 179.990  2 179.994  3 180.002 9 180.006  6 180.010 12 180.014  2 180.034  7

TABLE 16 provides measured values of the squareness (D3−D4) and thecorresponding frequency of the measured values of the plurality of tilescut with Cutting Technique 3.

TABLE 16 Cutting Technique 3 Squareness [mm] freq 0.0006 2 0.0014 10.0018 2 0.0022 2 0.0030 2 0.0034 2 0.0038 2 0.0042 2 0.0050 1 0.0054 10.0058 3 0.0062 3 0.0066 2 0.0070 4 0.0090 1 0.0094 1 0.0102 1 0.0106 40.0110 1 0.0118 2 0.0122 2

TABLE 17 provides measured values of the straightness (D5, D6) relativeto the first lateral dimension D1 and the corresponding frequency of themeasured values of the plurality of tiles cut with Cutting Technique 3.

TABLE 17 Cutting Technique 3 Straightness D1 [mm] freq 0.009 12 0.012 200.015  5 0.018  7 0.021  5 0.024  7 0.027  3 0.030  2 0.033  3 0.036  20.039  5 0.042  1 0.045  2 0.048  3 0.051  1 0.057  3 0.063  1

TABLE 18 provides measured values of the straightness (D7, D8) relativeto the second lateral dimension D2 and the corresponding frequency ofthe measured values of the plurality of tiles cut with Cutting Technique3.

TABLE 18 Cutting Technique 3 Straightness D2 [mm] freq 0.004  3 0.006 180.008 12 0.010  6 0.012 11 0.014  8 0.016  3 0.018  6 0.020  3 0.022  30.024  2 0.026  4 0.028  2 0.036  1

A fourth cutting technique (Cutting Technique 4) was employed using aTLC International Phoenix brand (e.g., Gen-3, Gen-5) mechanicalglass-cutting machine tool employing a precision scribe and breakprocess to cut 48 tiles. TABLES 19-23 provide measured values of thepredetermined parameters of each tile cut by Cutting Technique 4. Insome embodiments, where the total frequency of tiles differs from the 48tiles cut using Cutting Technique 4, it is to be understood that theparticular measurement may be omitted based at least on an error ordiscrepancy, where such omission is deemed to not alter the statisticalsignificance of the measured values. In particular, TABLE 19 providesmeasured values of the first lateral dimension D1 and the correspondingfrequency of the measured values of the plurality of tiles cut withCutting Technique 4.

TABLE 19 Cutting Technique 4 D1 [mm] freq 99.90  1 99.93 12 99.94 1099.97  1 100.03   1 100.12   2 100.13  15 100.14   6

TABLE 20 provides measured values of the second lateral dimension D2 andthe corresponding frequency of the measured values of the plurality oftiles cut with Cutting Technique 4.

TABLE 20 Cutting Technique 4 D2 [mm] freq 179.93  2 179.94 11 179.95  6179.96  1 179.98  1 179.99  1 180.09  1 180.11  1 180.13  1 180.14  4180.15 15

TABLE 21 provides measured values of the squareness (D3−D4) and thecorresponding frequency of the measured values of the plurality of tilescut with Cutting Technique 4.

TABLE 21 Cutting Technique 4 Squareness [mm] freq 0.002 1 0.003 3 0.0042 0.005 1 0.006 3 0.007 2 0.008 3 0.009 5 0.011 1 0.012 3 0.013 4 0.0144 0.015 5 0.016 4 0.017 2 0.022 1

TABLE 22 provides measured values of the straightness (D5, D6) relativeto the first lateral dimension D1 and the corresponding frequency of themeasured values of the plurality of tiles cut with Cutting Technique 4.

TABLE 22 Cutting Technique 4 Straightness D1 [mm] freq 0.036  2 0.038  10.042  4 0.044  4 0.046  7 0.048  7 0.050 11 0.052  7 0.054  5 0.056  50.058  5 0.060  4 0.062  4 0.064  8 0.066  2 0.068  4 0.070  5 0.072  20.076  1 0.078  1

TABLE 23 provides measured values of the straightness (D7, D8) relativeto the second lateral dimension D2 and the corresponding frequency ofthe measured values of the plurality of tiles cut with Cutting Technique4.

TABLE 23 Cutting Technique 4 Straightness D2 [mm] freq 0.020  2 0.025  20.030  2 0.035  2 0.040  3 0.045  9 0.050 14 0.055 14 0.060  8 0.065 110.070  6 0.075  3 0.080  4 0.085  3 0.090  1 0.095  2 0.105  1 0.125  10.130  1

Employing the measured values of TABLES 4-23, a computer simulation wasimplemented to randomly generate a plurality of tiles, where eachrandomly generated tile includes predetermined parameters (D1-D8) thatare statistically representative of the measured values. For example, byemploying the measured values, a computer simulation can randomlygenerate a statistically large number of tiles (e.g., 100,000 tiles,250,000 tiles, 500,000 tiles, 1,000,000 tiles, 10,000,000 tiles,100,000,000 tiles, etc.) accurately representing predeterminedparameters of the statistically large number of tiles that would beproduced by physically cutting tiles, without physically cutting andproducing the statistically large number of tiles. In some embodiments,the measured values of each predetermined parameter (e.g., first lateraldimension D1, second lateral dimension D2, squareness (D3−D4), D1straightness (D5, D6), and D2 straightness (D7, D8)) of each cuttingtechnique (e.g., Cutting Techniques 1-4) can be numerically fit with astatistical distribution from which the values of the predeterminedparameters of the statistically large number of tiles can be randomlygenerated. In particular, EQUATION 1 provides a normal (Gaussian)distribution and associated variables by which some of the predeterminedparameters of the statistically large number of tiles can be determinedbased on the measured values:

$\begin{matrix}{{{y(x)} = {\frac{A}{\sqrt{2\pi \sigma^{2}}}e^{- \frac{{({x - \mu})}^{2}}{2\sigma^{2}}}}}{\mu = {mean}}{\sigma = {SD}}{A = {n \cdot a}}{n = {{number}\mspace{14mu} {of}\mspace{14mu} {samples}}}{a = {{increment}\mspace{14mu} {between}\mspace{14mu} {values}}}} & {{EQUATION}\mspace{14mu} 1}\end{matrix}$

Similarly, EQUATION 2 provides a combined normal (Gaussian) distributionand associated variables by which some of the predetermined parametersof the statistically large number of tiles can be determined based onthe measured values:

$\begin{matrix}{{{y(x)} = {{\frac{A_{1}}{\sqrt{2\pi \sigma_{1}^{2}}}e^{- \frac{{({x - \mu_{1}})}^{2}}{2\sigma_{1}^{2}}}} + {\frac{A_{2}}{\sqrt{2{\pi\sigma}_{2}^{2}}}e^{- \frac{{({x - \mu_{2}})}^{2}}{2\sigma_{2}^{2}}}}}}\begin{matrix}{{\mu_{1} = {mean}},} & {{left}\mspace{14mu} {side}} \\{{\mu_{2} = {mean}},} & {{right}\mspace{14mu} {side}} \\{{\sigma_{1} = {SD}},} & {{left}\mspace{14mu} {side}} \\{{\sigma_{2} = {SD}},} & {{right}\mspace{14mu} {side}}\end{matrix}{A_{1} = {n_{1} \cdot a_{1}}}\begin{matrix}{{n_{1} = {{number}\mspace{14mu} {of}\mspace{14mu} {samples}}},} & {{left}\mspace{14mu} {side}} \\{{a_{1} = {{increment}\mspace{14mu} {between}\mspace{14mu} {values}}},} & {{left}\mspace{14mu} {side}}\end{matrix}{A_{2} = {n_{2} \cdot a_{2}}}\begin{matrix}{{n_{2} = {{number}\mspace{14mu} {of}\mspace{14mu} {samples}}},} & {{right}\mspace{14mu} {side}} \\{{a_{2} = {{increment}\mspace{14mu} {between}\mspace{14mu} {values}}},} & {{right}\mspace{14mu} {side}}\end{matrix}} & {{EQUATION}\mspace{14mu} 2}\end{matrix}$

Likewise, EQUATION 3 provides a log-normal distribution and associatedvariables by which some of the predetermined parameters of thestatistically large number of tiles can be determined based on themeasured values:

$\begin{matrix}{{{y(x)} = {\frac{A}{x\sigma \sqrt{2\pi}}e^{- \frac{{({{\ln x} - \mu})}^{2}}{2\sigma^{2}}}}}{\mu = {\ln( \frac{m}{\sqrt{1 + \frac{v}{m^{2}}}} )}}{\sigma = \sqrt{\ln ( {1 + \frac{v}{m^{2}}} )}}{m = {mean}}{v = {{variance} = {SD^{2}}}}{A = {n \cdot a}}{n = {{number}\mspace{14mu} {of}\mspace{14mu} {samples}}}{a = {{increment}\mspace{14mu} {between}\mspace{14mu} {values}}}} & {{EQUATION}\mspace{14mu} 3}\end{matrix}$

Accordingly, in some embodiments, depending on the distribution of thedata, one of EQUATIONS 1-3 was employed in combination with the measuredvalues of each of the predetermined parameters (D1-D8) of the tiles cutby each of the Cutting Techniques 1-4 to randomly generate predeterminedparameters for each tile of the statistically large number of tiles. Forexample, TABLES 24-43 provide the calculated variables that aredetermined based on the measured values of TABLES 4-23 and used incombination with one of EQUATIONS 1-3 to calculate the predeterminedparameters for each tile of the statistically large number of randomlygenerated tiles of Cutting Techniques 1-4. For purposes of thecalculations, it is assumed that all edges of the tile have the samedistribution; however, in some embodiments, one or more edges of thetile may have different distributions and may be provided by one or moredifferent cutting techniques or edge processing techniques (e.g.,grinding, polishing). In particular, for predetermined parametersrandomly generated based on EQUATION 1, the term “(normal)” is listed inthe table showing the respective variables calculated based on themeasured values and the corresponding normal distribution and associatedvariables. Likewise, for predetermined parameters randomly generatedbased on EQUATION 2, the term “(combined)” is listed in the tableshowing the respective variables calculated based on the measured valuesand the corresponding combined normal distribution and associatedvariables. Similarly, for predetermined parameters randomly generatedbased on EQUATION 3, the term “(ln)” is listed in the table showing therespective variables calculated based on the measured values and thecorresponding log-normal distribution and associated variables.

In particular, TABLES 24-28 provide the calculated variables that arerespectively determined based on the measured values of TABLES 4-8(e.g., first lateral dimension D1, second lateral dimension D2,squareness (D3−D4), D1 straightness (D5, D6), and D2 straightness (D7,D8)) and used in combination with one of EQUATIONS 1-3 (as identified)to randomly generate the predetermined parameters for each tile of thestatistically large number of tiles of Cutting Technique 1.

TABLE 24 Cutting Technique 1 D1 (normal) A 0.061701 μ 100.010497 σ0.004673 n 56 increment 0.001

TABLE 25 Cutting Technique 1 D2 (normal) A 0.084304 μ 180.410749 σ0.003399 n 56 increment 0.002

TABLE 26 Cutting Technique 1 Squareness (normal) A 0.014192 μ 0.002345 σ0.001371 n 56 increment 0.00025

TABLE 27 Cutting Technique 1 Straightness D1 (In) A 0.105273 μ −4.774432σ 0.323590 n 112 increment 0.001

TABLE 28 Cutting Technique 1 Straightness D2 (ln) A 0.105789 μ −5.368067σ 0.412470 n 111 increment 0.001

Additionally, TABLES 29-33 provide the calculated variables that arerespectively determined based on the measured values of TABLES 9-13(e.g., first lateral dimension D1, second lateral dimension D2,squareness (D3−D4), D1 straightness (D5, D6), and D2 straightness (D7,D8)) and used in combination with one of EQUATIONS 1-3 (as identified)to randomly generate the predetermined parameters for each tile of thestatistically large number of tiles of Cutting Technique 2.

TABLE 29 Cutting Technique 2 D1 (normal) A 0.023591 μ 100.007895 σ0.001783 n 51 increment 0.0005

TABLE 30 Cutting Technique 2 D2 (normal) A 0.099161 μ 180.017120 σ0.005532 n 51 increment 0.002

TABLE 31 Cutting Technique 2 Squareness (normal) A 0.049845 μ 0.007627 σ0.002713 n 51 increment 0.001

TABLE 32 Cutting Technique 2 Straightness D1 (ln) A 0.289375 μ −4.230247σ 0.322271 n 103 increment 0.004

TABLE 33 Cutting Technique 2 Straightness D2 (ln) A 0.239993 μ −4.400247σ 0.402618 n 103 increment 0.0025

Additionally, TABLES 34-38 provide the calculated variables that arerespectively determined based on the measured values of TABLES 14-18(e.g., first lateral dimension D1, second lateral dimension D2,squareness (D3−D4), D1 straightness (D5, D6), and D2 straightness (D7,D8)) and used in combination with one of EQUATIONS 1-3 (as identified)to randomly generate the predetermined parameters for each tile of thestatistically large number of tiles of Cutting Technique 3.

TABLE 34 Cutting Technique 3 D1 (normal) A 0.007848 μ 100.009255 σ0.001012 n 41 increment 0.0002

TABLE 35 Cutting Technique 3 D2 (normal) A 0.097189 μ 180.008736 σ0.002953 n 41 increment 0.004

TABLE 36 Cutting Technique 3 Squareness (normal) A 0.024709 μ 0.003598 σ0.004925 n 41 increment 0.0004

TABLE 37 Cutting Technique 3 Straightness D1 (ln) A 0.194481 μ −3.975518σ 0.614340 n 82 increment 0.003

TABLE 38 Cutting Technique 3 Straightness D2 (ln) A 0.155278 μ −4.477293σ 0.508459 n 82 increment 0.002

Additionally, TABLES 39-43 provide the calculated variables that arerespectively determined based on the measured values of TABLES 19-23(e.g., first lateral dimension D1, second lateral dimension D2,squareness (D3−D4), D1 straightness (D5, D6), and D2 straightness (D7,D8)) and used in combination with one of EQUATIONS 1-3 (as identified)to randomly generate the predetermined parameters for each tile of thestatistically large number of tiles of Cutting Technique 4.

TABLE 39 Cutting Technique 4 D1 (combined) A1 0.084886 A2 0.172186 μ199.930012 μ2 100.127675 σ1 0.002822 σ2 0.003806 n 48 increment 0.01

TABLE 40 Cutting Technique 4 D2 (combined) A1 0.081416 A2 0.136028 μ1179.939839 μ2 180.152107 σ1 0.002948 σ2 0.002348 n 44 increment 0.01

TABLE 41 Cutting Technique 4 Squareness (normal) A 0.046461 μ 0.011593 σ0.004478 n 44 increment 0.001

TABLE 42 Cutting Technique 4 Straightness D1 (ln) A 0.168655 μ −2.931805σ 0.208692 n 89 increment 0.002

TABLE 43 Cutting Technique 4 Straightness D2 (ln) A 0.424900 μ −2.857647σ 0.215864 n 89 increment 0.005

Moreover, in some embodiments, a further computer simulation can beimplemented to simulate assembly of the statistically large number oftiles including the randomly generated predetermined parameters D1-D8into (n×m) arrays of various sizes. In some embodiments, practicalmethods of assembling a display area can be employed with one or morestrategies based on information obtained by the computer simulation. Asdiscussed more fully below, in some embodiments, employing the one ormore strategies can provide one or more advantages with respect to theassembly and positioning of the plurality of tiles into the array thatmay not otherwise be obtainable without employing the one or morestrategies.

For example, in some embodiments, a computer simulation can simulateassembly of each of the randomly generated tiles into one of a varietyof arrays. In some embodiments, each tile can be positioned in the arraybased on a global position method where positioning of the tile is basedon a predetermined global spatial coordinate irrespective of therelative position of other tiles. Alternatively, in some embodiments,each tile can be positioned in the array based on a relative positionmethod where positioning of the tile is based on a relative position ofimmediately adjacent tiles (i.e. one or more tiles positioned directlynext to each other without other tiles therebetween) irrespective of theglobal spatial coordinate of the tile. Moreover, in some embodiments,whether employed with the global position method or the relativeposition method, during the simulation, if a tile is positioned in anoverlapping relationship relative to one or more immediately adjacenttiles, the simulation can selectively adjust the position of the tilerelative to the one or more immediately adjacent tiles such that thetile is positioned into the array in a non-overlapping relationshiprelative to the one or more immediately adjacent tiles.

Turning to FIG. 5, methods of assembling a display area 510 of a displaydevice 500 will now be described with the understanding that one or morefeatures of the display area 101 and the display device 100 can beprovided alone or in combination with one or more features of thedisplay area 510 and the display device 500. It is to be understood thatthe methods of assembling the display area 510 can be employed as acomputer simulation and/or as an actual method of assembling a displayarea 510 to be employed in one or more display devices 500 in accordancewith embodiments of the disclosure.

In some embodiments, the method can include providing a plurality oftiles 505 (e.g., a first tile 501, a second tile 502, a third tile 503,and a fourth tile 504) with the understanding that each tile 501, 502,503, 504 of the plurality of tiles 505 can include one or more featuresof the tile 105 ij of the plurality of tiles 105 including one or morepredetermined parameters (See FIG. 2, predetermined parameters D1-D8)and a plurality of microLEDs defining a plurality of pixels (See FIG. 3,plurality of pixels 305, plurality of microLEDs 300, and FIG. 5microLEDs 405 a, 405 b, 405 c). Additionally, although four tiles 501,502, 503, 504 are illustrated, it is to be understood that, in someembodiments, the plurality of tiles 505 can include more than fourtiles. For example, in some embodiments, the plurality of tiles 505 caninclude 25 tiles to be assembled into a 5×5 array defining the displayarea 510, 36 tiles to be assembled into a 6×6 array defining the displayarea 510, 49 tiles to be assembled into a 7×7 array defining the displayarea 510, 64 tiles to be assembled into a 8×8 array defining the displayarea 510, 81 tiles to be assembled into a 9×9 array defining the displayarea 510, 100 tiles to be assembled into a 10×10 array defining thedisplay area 510, or any other number of tiles to be assembled into an×m array (See FIG. 1) without departing from the scope of thedisclosure. In some embodiments, n can equal m (e.g., 5×5 array, 6×6array, 7×7 array, etc.), and in some embodiments, n and m may bedifferent (e.g., 5×6 array, 6×8 array, 7×10 array, etc.).

Turning back to FIG. 5, in some embodiments, a lateral distance 512between at least one first outer pixel 521 a of the first tile 501spaced from a first edge 501 a of the first tile 501 and at least onesecond outer pixel 522 a of the second tile 502 spaced from a secondedge 502 a of the second tile 502 can define a registration pitch 512.Likewise, in some embodiments, a lateral distance 513 between at leastone first outer pixel 521 b of the first tile 501 spaced from a secondedge 501 b of the first tile 501 and at least one second outer pixel 523b of the third tile 503 spaced from a second edge 503 b of the thirdtile 503 can define a registration pitch 513. In some embodiments, theregistration pitch 512 can be defined based on a first lateral offset531 a of the at least one first outer pixel 521 a from the first edge501 a of the first tile 501, a second lateral offset 532 a of the atleast one second outer pixel 522 a from the second edge 502 a of thesecond tile 502, and a space (e.g., gap 534) between the first edge 501a of the first tile 501 and the second edge 502 a of the second tile502. Likewise, in some embodiments, the registration pitch 513 can bedefined based on a first lateral offset 531 b of the at least one firstouter pixel 521 b from the second edge 501 b of the first tile 501, asecond lateral offset 533 b of the at least one second outer pixel 523 bfrom the second edge 503 b of the third tile 503, and a space (e.g., gap535) between the second edge 501 b of the first tile 501 and the secondedge 503 b of the third tile 503. In some embodiments, the lateraloffsets 531 a, 532 a, 531 b, and 533 b can be defined as respectivedistances from a center of respective outer pixels to a nearest locationof the cut edge of the tile, selected so that the cut edge does notinterfere with electronic operation of the respective outer pixels.Moreover, as additional tiles are assembled into the array, respectiveregistration pitches can be defined between immediately adjacent outerpixels of immediately adjacent tiles of the additional tiles.

In some embodiments, the gap 534, 535 can be selected to prevent contactbetween immediately adjacent edges (edge 501 a and edge 502 a, edge 501b and edge 503 b) of the tiles 501, 502, 503. In some embodiments,preventing contact between immediately adjacent edges of the tiles 501,502, 503 can prevent chipping, cracking, breakage, and other damage ofthe immediately adjacent edges that may otherwise occur if theimmediately adjacent edges were to contact. For example, in someembodiments, the gap 534, 535 can be from about 5 micrometers to about200 micrometers, including all ranges and subranges therebetween. Forexample, in some embodiments, the gap 534, 535 can from about 5micrometers to about 50 micrometers, from about 50 micrometers to about100 micrometers, from about 100 micrometers to about 200 micrometers.Moreover, in some embodiments, the gap 534, 535 can vary along therespective immediately adjacent edges (edge 501 a and edge 502 a, edge501 b and edge 503 b) of the tiles 501, 502, 503 based on deviation ofat least one value of the predetermined parameters (e.g., first lateraldimension D1, second lateral dimension D2, squareness (D3−D4), D1straightness (D5, D6), and D2 straightness (D7, D8)) from acorresponding value of the nominal tile 200 (See FIG. 2).

In some embodiments, the lateral offsets 531 a, 532 a, 531 b, 533 b canbe provided on each tile 501, 502, 503 such that the at least one outerpixels 521 a, 522 a, 521 b, 523 b including the associated electronics(e.g., thin film transistors, wiring) and microLEDs are spaced adistance from the respective edges 501 a, 502 a, 501 b, 503 b of thetiles 501, 502, 503 to, for example, protect the microLEDs fromelectrical or mechanical damage that may otherwise occur if the at leastone outer pixels 521 a, 522 a, 521 b, 523 b including the associatedelectronics and microLEDs were flush with the respective edges 501 a,502 a, 501 b, 503 b of the tiles 501, 502, 503. In some embodiments, thelateral offsets 531 a, 532 a, 531 b, 533 b can be in a range from about0.02 mm to about 0.6 mm, including all ranges and subrangestherebetween. For example, in some embodiments, the lateral offsets 531a, 532 a, 531 b, 533 b can be from about 0.02 mm to about 0.05 mm, fromabout 0.05 mm to about 0.1 mm, from about 0.1 mm to about 0.2 mm, fromabout 0.2 mm to about 0.3 mm, from about 0.3 mm to about 0.4 mm, fromabout 0.4 mm to about 0.5 mm, from about 0.5 mm to about 0.6 mm.

In some embodiments, defining a predetermined registration pitch withrespect to all immediately adjacent tiles assembled into an arraydefining a display area of a display device can provide a criterionwhere, for example, registration pitches equal to or less than thepredetermined registration pitch can be deemed acceptable, andregistration pitches greater than the predetermined registration pitchcan be deemed unacceptable. In some embodiments, acceptable registrationpitches can correspond to a visually uniform, seamless display area,where boundaries of and between all immediately adjacent individualtiles assembled into the array are not visually discernable to a humaneye viewing the plurality of pixels defining the display area.Alternatively, in some embodiments, unacceptable registration pitchescan correspond to a display area where boundaries of and between one ormore immediately adjacent individual tiles assembled into the array arevisually discernable to the human eye viewing the plurality of pixelsdefining the display area.

For example, in some embodiments, an unacceptable array of a displayarea can be defined as an array including one or more immediatelyadjacent outer pixels of immediately adjacent tiles spaced a lateraldistance greater than the predetermined registration pitch. Likewise, insome embodiments, an acceptable array of a display area can be definedas an array where all immediately adjacent outer pixels of immediatelyadjacent tiles spaced a lateral distance less than or equal to thepredetermined registration pitch. In some embodiments, a failure (e.g.,during a computer simulation simulating assembly of the tiles into anarray) can be defined as a simulated occurrence of an unacceptabledisplay area. Likewise, in some embodiments, a failure rate (e.g.,during a computer simulation simulating assembly of the tiles into anarray) can be defined as a ratio of a simulated occurrence of anunacceptable display area to a simulated occurrence of an acceptabledisplay area. For example, in some embodiments, with respect to thecomputer simulation simulating assembly of the tiles into an array, afailure rate of 100% can correspond to a simulation where all simulatedarrays included an unacceptable display area, and a failure rate of 0%can correspond to a simulation where all simulated arrays included anacceptable display area.

In some embodiments, the registration pitch 512, 513 can be less than orequal to about 1.5 times the pixel pitch (See FIG. 3, pixel pitch px,py). Additionally, in some embodiments, the registration pitch 512, 513can be less than or equal to about 1.4 times the pixel pitch px, py,less than or equal to about 1.3 times the pixel pitch px, py, less thanor equal to about 1.25 times the pixel pitch px, py, less than or equalto about 1.2 times the pixel pitch px, py, or less than or equal toabout 1.1 times the pixel pitch px, py. Moreover, in some embodiments,the registration pitch 512, 513 can be less than or equal to about 1.01times the pixel pitch px, py or less than or equal to the pixel pitchpx, py. In some embodiments, the registration pitch 512 can be differentthan the registration pitch 513. Likewise, in some embodiments, theregistration pitch 512 can be based on at least one of pixel pitch pxand pixel pitch py, and the registration pitch 513 can be based on atleast one of pixel pitch px and pixel pitch py. In some embodiments,registration pitch 512 can be based on at least one of pixel pitch px,py in the same or different proportion relative to registration pitch513. In some embodiments, the registration pitch 512, 513 can beselected based on one or more additional factors including, but notlimited to, an application in which the display area is to be employed.In some embodiments, defining the registration pitch 512, 513 based onthe pixel pitch px, py can provide a corresponding display area thatappears to the human eye as a uniform, seamless array of pixelsproviding a high-quality, visually appealing display to be employed inone or more display devices in accordance with embodiments of thedisclosure.

With respect to FIG. 6, FIG. 7, TABLE 44, and TABLE 45, an exemplarycomputer simulation was employed to compare differences among CuttingTechniques 1-4. In particular, the computer simulation simulated theassembly of the statistically large number of tiles, including therandomly generated values of predetermined parameters D1-D8, intomultiple arrays defining multiple respective display arrays. In thecomputer simulation, a relative position method was employed with afailure criterion defined with respect to registration pitches greaterthan 1.1 times the corresponding pixel pitch px, py.

FIG. 6 illustrates an exemplary plot based on a simulated assembly ofdisplay areas including a plurality of tiles with a lateral offset of 50micrometers for each Cutting Technique 1-4 in accordance withembodiments of the disclosure, where the vertical or “Y” axis representsfailure rate in percentage (%) and the horizontal or “X” axis representspixel pitch in micrometers (μm). Additionally, TABLE 44 provides thedata on which the plot shown in FIG. 6 is based for each CuttingTechnique 1-4 relative to the defined failure criterion for pixelpitches ranging from 50 micrometers to 500 micrometers, where line 601 arepresents the associated failure rate of Cutting Technique 1, line 602a represents the associated failure rate of Cutting Technique 2, line603 a represents the associated failure rate of Cutting Technique 3, andline 604 a represents the associated failure rate of Cutting Technique4.

TABLE 44 Display Area Array Assembly Simulation - 50 um Lateral OffsetCutting Cutting Cutting Cutting Technique 1 Technique 2 Technique 3Technique 4 Pixel Pitch [um] 601a 602a 603a 604a 50 1.000 1.000 1.0001.000 100 1.000 1.000 1.000 1.000 150 0.035 0.960 1.000 1.000 200 0.0000.000 0.691 1.000 250 0.000 0.000 0.092 0.876 300 0.000 0.000 0.0120.005 350 0.000 0.000 0.002 0.000 400 0.000 0.000 0.000 0.000 450 0.0000.000 0.000 0.000 500 0.000 0.000 0.000 0.000

As can be seen from FIG. 6 and TABLE 44, based on the computersimulation, in some embodiments, a failure rate of about 10% or less canbe achieved for display areas including a plurality of arrayed tileswith a pixel pitch of about 150 micrometers or greater by employingCutting Technique 1. Likewise, a failure rate of about 10% or less canbe achieved for display areas including a plurality of arrayed tileswith a pixel pitch of about 200 micrometers or greater by employingCutting Technique 2, a failure rate of about 10% or less can be achievedfor display areas including a plurality of arrayed tiles with a pixelpitch of about 250 micrometers or greater by employing Cutting Technique3, and a failure rate of about 10% or less can be achieved for displayareas including a plurality of arrayed tiles with a pixel pitch of about300 micrometers or greater by employing Cutting Technique 4.

FIG. 7 illustrates an exemplary plot based on a simulated assembly ofdisplay areas including a plurality of tiles with a lateral offset of100 micrometers for each Cutting Technique 1-4 in accordance withembodiments of the disclosure, where the vertical or “Y” axis representsfailure rate in percentage (%) and the horizontal or “X” axis representspixel pitch in micrometers (μm). Additionally, TABLE 45 provides thedata on which the plot shown in FIG. 7 is based for each CuttingTechnique 1-4 relative to the defined failure criterion for pixelpitches ranging from 50 micrometers to 500 micrometers, where line 601 brepresents the associated failure rate of Cutting Technique 1, line 602b represents the associated failure rate of Cutting Technique 2, line603 b represents the associated failure rate of Cutting Technique 3, andline 604 b represents the associated failure rate of Cutting Technique4.

TABLE 45 Display Area Array Assembly Simulation - 100 um Lateral OffsetCutting Cutting Cutting Cutting Technique 1 Technique 2 Technique 3Technique 4 Pixel Pitch [um] 601b 602b 603b 604b 50 1.000 1.000 1.0001.000 100 1.000 1.000 1.000 1.000 150 1.000 1.000 1.000 1.000 200 1.0001.000 1.000 1.000 250 0.001 0.459 1.000 1.000 300 0.000 0.000 0.5131.000 350 0.000 0.000 0.062 0.556 400 0.000 0.000 0.009 0.001 450 0.0000.000 0.002 0.000 500 0.000 0.000 0.000 0.000

As can be seen from FIG. 7 and TABLE 45, based on the computersimulation, in some embodiments, a failure rate of about 10% or less canbe achieved for display areas including a plurality of arrayed tileswith a pixel pitch of about 250 micrometers or greater by employingCutting Technique 1. Likewise, a failure rate of about 10% or less canbe achieved for display areas including a plurality of arrayed tileswith a pixel pitch of about 300 micrometers or greater by employingCutting Technique 2, a failure rate of about 10% or less can be achievedfor display areas including a plurality of arrayed tiles with a pixelpitch of about 350 micrometers or greater by employing Cutting Technique3, and a failure rate of about 10% or less can be achieved for displayareas including a plurality of arrayed tiles with a pixel pitch of about400 micrometers or greater by employing Cutting Technique 4.

Accordingly, based on the results of the computer simulation shown inFIG. 6 and FIG. 7, one may select a particular cutting technique (e.g.,Cutting Technique 1-4) to cut the plurality of tiles based on anacceptable failure rate and a predetermined pixel pitch. In someembodiments, a respective cost of the cutting technique can beconsidered and factored into selection of the cutting technique to beemployed. For example, in some embodiments, Cutting Technique 1 can beselected to cut tiles to be employed in high-quality display areas(e.g., mobile displays, television displays); whereas, Cutting Technique4 can be selected to cut tiles to be employed in relatively lowerquality display areas (e.g., outdoor signage). In some embodiments,Cutting Technique 1 can be relatively more expensive and/or timeconsuming to employ than, for example, Cutting Technique 4. Thus,considerable advantages can be obtained by selecting one of CuttingTechniques 1-4 based on the information obtained from the computersimulations provided in FIG. 6 and FIG. 7.

Moreover, as described with respect to FIGS. 8-11 and TABLES 46-57,further computer simulations were employed based on randomly generatedvalues of predetermined parameters D1-D8 for a statistically largenumber of tiles corresponding to Cutting Technique 3 with apredetermined pixel pitch (px, py) of 372 micrometers for lateraloffsets (See FIG. 5, lateral offsets 531 a, 532 a, 531 b, 533 b) of 50micrometers and 100 micrometers, where px equals py. Each of thesimulated tiles, including the randomly generated values ofpredetermined parameters D1-D8, was assembled into a plurality of (n×m)arrays employing a global positioning method and a relative positioningmethod. Additionally, registration pitches of 1.5 times the pixel pitch,1.1 times the pixel pitch, and 1.01 times the pixel pitch weresimulated. For each simulated scenario, the simulation was repeated1,000,000 times to provide a statistical sample from whichrepresentative trends and conclusions can be formed. Moreover, it is tobe understood that the observed trends based on the computer simulationsof Cutting Technique 3 (FIGS. 8-11 and TABLES 46-57) can provide equallyrelevant conclusions with respect to Cutting Technique 1, CuttingTechnique 2, and Cutting Technique 4 in consideration of the comparativedata provided in FIG. 6, FIG. 7, TABLE 44, and TABLE 45.

Additionally, three different tiling strategies were simulated and therespective failure rates of the display areas were recorded. A firsttiling strategy can include randomly selecting each tile to be assembledinto the arrays. For example, in some embodiments, with respect to thefirst tiling strategy, the computer simulation randomly selected eachtile, including the randomly generated values of predeterminedparameters D1-D8, without consideration of the randomly generated valuesof predetermined parameters D1-D8, and assembled the tile into thevarious arrays in accordance with embodiments of the disclosure.

TABLE 46 provides failure rates of the computer simulations employingthe first tiling strategy with respect to 50 micrometer lateral offsettiles employing a global positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 46 50 Micrometer Lateral Offset - Tiling Strategy 1 GlobalPosition Method Registration Pitch × Pixel Pitch 1.5× 1.1× 1.01× Array —701a 701b  5 × 5 0.000004 0.000265 0.000647  6 × 6 0.000011 0.0003970.001060  7 × 7 0.000013 0.000567 0.001486  8 × 8 0.000020 0.0009190.002463  9 × 9 0.000037 0.001452 0.003805 10 × 10 0.000059 0.0022450.005908

Additionally, FIG. 8 illustrates an exemplary plot based on thesimulated assembly of the first tiling strategy of TABLE 46, where thevertical or “Y” axis represents failure rate in percentage (%) and thehorizontal or “X” axis represents display area size in number of tilesin an array (n×m). In particular, line 701 a represents the respectivefailure rates for the various arrays with respect to a registrationpitch of 1.1 times the pixel pitch for the 50 micrometer offset tilesassembled with the global positioning method employing the first tilingstrategy, and line 701 b represents the respective failure rates for thevarious arrays with respect to a registration pitch of 1.01 times thepixel pitch for the 50 micrometer offset tiles assembled with the globalpositioning method employing the first tiling strategy.

TABLE 47 provides failure rates of the computer simulations employingthe first tiling strategy with respect to 50 micrometer lateral offsettiles employing a relative positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 47 50 Micrometer Pixel Offset - Tiling Strategy 1 RelativePosition Method Registration Pitch x Pixel Pitch 1.5× 1.1× 1.01× Array —701c 701d  5 × 5 0.000006 0.000241 0.000612  6 × 6 0.000006 0.0003160.000967  7 × 7 0.000013 0.000514 0.001302  8 × 8 0.000023 0.0006680.001728  9 × 9 0.000023 0.000857 0.002224 10 × 10 0.000039 0.0010360.002730

Additionally, FIG. 9 illustrates an exemplary plot based on thesimulated assembly of the first tiling strategy of TABLE 47, where thevertical or “Y” axis represents failure rate in percentage (%) and thehorizontal or “X” axis represents display area size in number of tilesin an array (n×m). In particular, line 701 c represents the respectivefailure rates for the various arrays with respect to a registrationpitch of 1.1 times the pixel pitch for the 50 micrometer offset tilesassembled with the relative positioning method employing the firsttiling strategy, and line 701 d represents the respective failure ratesfor the various arrays with respect to a registration pitch of 1.01times the pixel pitch for the 50 micrometer offset tiles assembled withthe relative positioning method employing the first tiling strategy.

TABLE 48 provides failure rates of the computer simulations employingthe first tiling strategy with respect to 100 micrometer lateral offsettiles employing a global positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 48 100 Micrometer Lateral Offset - Tiling Strategy 1 GlobalPosition Method Registration Pitch × Pixel Pitch 1.5× 1.1× 1.01× Array —704a 704b  5 × 5 0.000061 0.005539 0.020601  6 × 6 0.000101 0.0086580.031354  7 × 7 0.000149 0.011776 0.042760  8 × 8 0.000190 0.0159210.057151  9 × 9 0.000249 0.020496 0.072925 10 × 10 0.000292 0.0258010.091573

Additionally, FIG. 10 illustrates an exemplary plot based on thesimulated assembly of the first tiling strategy of TABLE 48, where thevertical or “Y” axis represents failure rate in percentage (%) and thehorizontal or “X” axis represents display area size in number of tilesin an array (n×m). In particular, line 704 a represents the respectivefailure rates for the various arrays with respect to a registrationpitch of 1.1 times the pixel pitch for the 100 micrometer offset tilesassembled with the global positioning method employing the first tilingstrategy, and line 704 b represents the respective failure rates for thevarious arrays with respect to a registration pitch of 1.01 times thepixel pitch for the 100 micrometer offset tiles assembled with theglobal positioning method employing the first tiling strategy.

TABLE 49 provides failure rates of the computer simulations employingthe first tiling strategy with respect to 100 micrometer lateral offsettiles employing a relative positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 49 100 Micrometer Lateral Offset - Tiling Strategy 1 RelativePosition Method Registration Pitch × Pixel Pitch 1.5× 1.1× 1.01× Array —704c 704d  5 × 5 0.000060 0.005630 0.020532  6 × 6 0.000106 0.0083850.030667  7 × 7 0.000135 0.011832 0.042709  8 × 8 0.000166 0.0155660.056647  9 × 9 0.000243 0.020022 0.071737 10 × 10 0.000298 0.0253270.090438

Additionally, FIG. 11 illustrates an exemplary plot based on thesimulated assembly of the first tiling strategy of TABLE 49, where thevertical or “Y” axis represents failure rate in percentage (%) and thehorizontal or “X” axis represents display area size in number of tilesin an array (n×m). In particular, line 704 c represents the respectivefailure rates for the various arrays with respect to a registrationpitch of 1.1 times the pixel pitch for the 100 micrometer offset tilesassembled with the relative positioning method employing the firsttiling strategy, and line 704 d represents the respective failure ratesfor the various arrays with respect to a registration pitch of 1.01times the pixel pitch for the 100 micrometer offset tiles assembled withthe relative positioning method employing the first tiling strategy.

A second tiling strategy can include selecting specific tiles to beassembled into an outer perimeter of the arrays and selecting othertiles to be assembled into an inner portion of the arrays. For example,in some embodiments, with respect to the second tiling strategy, thecomputer simulation selected a plurality of tiles with randomlygenerated values of predetermined parameters D1-D8 defining a firstdeviation relative to the respective nominal values and positioningthose tiles around the outer perimeter of the various arrays inaccordance with embodiments of the disclosure. Additionally, in someembodiments, with respect to the second tiling strategy, the computersimulation selected a plurality of tiles with randomly generated valuesof predetermined parameters D1-D8 defining a second deviation relativeto the respective nominal values and positioning those tiles in theinner portion of the various arrays in accordance with embodiments ofthe disclosure. In some embodiments, the first deviation of the outertiles was greater than the second deviation of the inner tiles.

TABLE 50 provides failure rates of the computer simulations employingthe second tiling strategy with respect to 50 micrometer lateral offsettiles employing a global positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 50 50 Micrometer Lateral Offset - Tiling Strategy 2 GlobalPosition Method Registration Pitch × Pixel Pitch 1.5× 1.1× 1.01× Array —702a 702b  5 × 5 0.000002 0.000318 0.000910  6 × 6 0.000022 0.0012260.003713  7 × 7 0.000109 0.008459 0.024156  8 × 8 0.000601 0.0519920.123760  9 × 9 0.004356 0.214476 0.388026 10 × 10 0.027814 0.5290030.730551

Additionally, FIG. 8 illustrates an exemplary plot based on thesimulated assembly of the second tiling strategy of TABLE 50. Inparticular, line 702 a represents the respective failure rates for thevarious arrays with respect to a registration pitch of 1.1 times thepixel pitch for the 50 micrometer offset tiles assembled with the globalpositioning method employing the second tiling strategy, and line 702 brepresents the respective failure rates for the various arrays withrespect to a registration pitch of 1.01 times the pixel pitch for the 50micrometer offset tiles assembled with the global positioning methodemploying the second tiling strategy.

TABLE 51 provides failure rates of the computer simulations employingthe second tiling strategy with respect to 50 micrometer lateral offsettiles employing a relative positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 51 50 Micrometer Lateral Offset - Tiling Strategy 2 RelativePosition Method Registration Pitch × Pixel Pitch 1.5× 1.1× 1.01× Array —702c 702d  5 × 5 0.000011 0.000256 0.000731  6 × 6 0.000009 0.0004430.001230  7 × 7 0.000015 0.000718 0.001987  8 × 8 0.000014 0.0010160.003065  9 × 9 0.000031 0.001451 0.004198 10 × 10 0.000042 0.0019250.005782

Additionally, FIG. 9 illustrates an exemplary plot based on thesimulated assembly of the second tiling strategy of TABLE 51. Inparticular, line 702 c represents the respective failure rates for thevarious arrays with respect to a registration pitch of 1.1 times thepixel pitch for the 50 micrometer offset tiles assembled with therelative positioning method employing the second tiling strategy, andline 702 d represents the respective failure rates for the variousarrays with respect to a registration pitch of 1.01 times the pixelpitch for the 50 micrometer offset tiles assembled with the relativepositioning method employing the second tiling strategy.

TABLE 52 provides failure rates of the computer simulations employingthe second tiling strategy with respect to 100 micrometer lateral offsettiles employing a global positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 52 100 Micrometer Lateral Offset - Tiling Strategy 2 GlobalPosition Method Registration Pitch × Pixel Pitch 1.5x 1.1× 1.01× Array —705a 705b  5 × 5 0.000067 0.007784 0.029789  6 × 6 0.000122 0.0138650.051185  7 × 7 0.000211 0.025224 0.085809  8 × 8 0.000689 0.0669310.177813  9 × 9 0.004638 0.221722 0.414980 10 × 10 0.027967 0.5311460.737177

Additionally, FIG. 10 illustrates an exemplary plot based on thesimulated assembly of the second tiling strategy of TABLE 52. Inparticular, line 705 a represents the respective failure rates for thevarious arrays with respect to a registration pitch of 1.1 times thepixel pitch for the 100 micrometer offset tiles assembled with theglobal positioning method employing the second tiling strategy, and line705 b represents the respective failure rates for the various arrayswith respect to a registration pitch of 1.01 times the pixel pitch forthe 100 micrometer offset tiles assembled with the global positioningmethod employing the second tiling strategy.

TABLE 53 provides failure rates of the computer simulations employingthe second tiling strategy with respect to 100 micrometer lateral offsettiles employing a relative positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 53 100 Micrometer Lateral Offset - Tiling Strategy 2 RelativePosition Method Registration Pitch × Pixel Pitch 1.5× 1.1× 1.01× Array —705c 705d  5 × 5 0.000064 0.007814 0.029861  6 × 6 0.000113 0.0134080.050801  7 × 7 0.000181 0.021537 0.077855  8 × 8 0.000245 0.0317670.111510  9 × 9 0.000343 0.044165 0.150601 10 × 10 0.000490 0.0594700.195972

Additionally, FIG. 11 illustrates an exemplary plot based on thesimulated assembly of the second tiling strategy of TABLE 53. Inparticular, line 705 c represents the respective failure rates for thevarious arrays with respect to a registration pitch of 1.1 times thepixel pitch for the 100 micrometer offset tiles assembled with therelative positioning method employing the second tiling strategy, andline 705 d represents the respective failure rates for the variousarrays with respect to a registration pitch of 1.01 times the pixelpitch for the 100 micrometer offset tiles assembled with the relativepositioning method employing the second tiling strategy.

With respect to the second tiling strategy, it was hypothesized thatfailure rates of the display areas could be reduced by employing thesecond tiling strategy relative to the first tiling strategy. However,as provided in FIGS. 8-11, it can be seen that respective failure ratesof the second tiling strategy (e.g., lines 702 a, 702 b, 702 c, 702 d,and lines 705 a, 705 b, 705 c, 705 d) increased relative to the firsttiling strategy (e.g., lines 701 a, 701 b, 701 c, 701 d, and lines 704a, 704 b, 704 c, 704 d). Therefore, in some embodiments, the secondtiling strategy can produce higher failure rates than the first tilingstrategy.

Turning back to FIG. 5, a third tiling strategy can include selecting afirst tile 501 of the plurality of tiles 505 based on a value of thepredetermined parameter D1-D8 of the first tile 501 and selecting asecond tile 502 of the plurality of tiles 505 based on a value of thepredetermined parameter D1-D8 of the second tile 502. In someembodiments, the method can include positioning the first tile 501 andthe second tile 502 into an array 506 defining at least a portion of thedisplay area 510. In some embodiments, a first edge 501 a of the firsttile 501 can face a second edge 502 a of the second tile 502.

In some embodiments, the value of the predetermined parameter D1-D8 ofthe first tile 501 can be greater than a nominal value of thepredetermined parameter D1-D8, and the value of the predeterminedparameter D1-D8 of the second tile 502 can be less than the nominalvalue of the predetermined parameter D1-D8. In some embodiments, thevalue of the predetermined parameter D1-D8 of the first tile 501 candefine a greatest value of the predetermined parameters D1-D8 of theplurality of tiles 505 relative to a nominal value of the predeterminedparameter, D1-D8 and the value of the predetermined parameter D1-D8 ofthe second tile 502 can define a smallest value of the predeterminedparameters D1-D8 of the plurality of tiles 505 relative to the nominalvalue of the predetermined parameter D1-D8.

For example, in some embodiments, by selecting the first tile 501 with avalue of the predetermined parameter D1-D8 greater than a nominal valueof the predetermined parameter D1-D8, and the second tile 502 with avalue of the predetermined parameter D1-D8 less than the nominal valueof the predetermined parameter D1-D8, the respective deviations of thefirst tile 501 and the second tile 502 relative to the nominal tile, canoffset (e.g., cancel) each other. Accordingly, in some embodiments, itwas hypothesized that by selecting the tiles based on a value of thepredetermined parameters D1-D8, and assembling the tiles in a mannerwhere deviations of the tiles relative to a nominal tile can cancel eachother, that a reduction of failure rates of the corresponding displayswould be obtained.

In some embodiments, the method can further include sorting theplurality of tiles 505 based on a respective value of the predeterminedparameter D1-D8 of the plurality of tiles 505. In some embodiments, thesorting can include identifying a first set of tiles and a second set oftiles. Likewise, in some embodiments, the sorting can includeidentifying a plurality of sets of tiles (e.g., more than two sets oftiles) based on a respective value of the predetermined parameter D1-D8of the plurality of tiles 505. In some embodiments, the respective valueof the predetermined parameter D1-D8 of each tile of the first set oftiles can be greater than a nominal value of the predetermined parameterD1-D8, and the respective value of the predetermined parameter D1-D8 ofeach tile of the second set of tiles can be less than the nominal valueof the predetermined parameter D1-D8. In some embodiments, the methodcan further include ordering the first set of tiles in ascending orderor descending order based on the respective value of the predeterminedparameter D1-D8 of each tile of the first set of tiles, and ordering thesecond set of tiles in ascending order or descending order based on therespective value of the predetermined parameter D1-D8 of each tile ofthe second set of tiles. In some embodiments, the first tile 501 can beselected from the first set of tiles and the second tile 502 can beselected from the second set of tiles.

In some embodiments, the value of the predetermined parameter D1-D8 ofthe first tile 501 can define a greatest value of the predeterminedparameters D1-D8 of the first set of tiles relative to the nominal valueof the predetermined parameter D1-D8, and the value of the predeterminedparameter D1-D8 of the second tile 502 can define a smallest value ofthe predetermined parameters D1-D8 of the second set of tiles relativeto the nominal value of the predetermined parameter D1-D8.

In some embodiments, the method can further include selecting at leastone additional tile (e.g., third tile 503, fourth tile 504) of theplurality of tiles 505 based on a value of the predetermined parameterD1-D8 of the at least one additional tile 503, 504 and positioning theat least one additional tile 503, 504 into the array 506. For example,in some embodiments, the third tile 503 can be positioned into the array506 with a second edge 503 b of the third tile 503 facing a second edge501 b of the first tile 501. Likewise, as represented by arrow 525, insome embodiments, the fourth tile 504 can be positioned into the array506 with a first edge 504 a of the fourth tile 504 facing a first edge503 a of the third tile 503 and a second edge 504 b of the fourth tile504 facing a second edge 502 b of the second tile 502. In someembodiments, the method can be repeated a plurality of times byselecting at least one additional tile of the plurality of tiles 505based on a value of the predetermined parameter D1-D8 of the at leastone additional tile and positioning the at least one additional tileinto the array 506 until the display area 510 includes a predeterminednumber of tiles.

In addition or alternatively, in some embodiments, the method ofassembling the display area 510 can include selecting a plurality ofpairs of tiles based on a respective value of the predeterminedparameter D1-D8 of each tile. In some embodiments, each pair of tilescan include a first tile and a second tile. For example, a first pair oftiles 515 a can include first tile 501 and second tile 502, and a secondpair of tiles 515 b can include third tile 503 and fourth tile 504. Insome embodiments, the respective value of the predetermined parameterD1-D8 of the first tile (e.g., tile 501, tile 503) of each pair 515 a,515 b can be greater than the respective value of the predeterminedparameter D1-D8 of the second tile (e.g. tile 502, tile 504) of eachpair 515 a, 515 b. The method can further include positioning theplurality of pairs of tiles 515 a, 515 b into the array 506 defining atleast a portion of the display area 510. In some embodiments, arespective first edge 501 a, 503 a of the first tile (e.g. tile 501,tile 503) of each pair 515 a, 515 b can face a respective second edge502 a, 504 a of the second tile (e.g. tile 502, tile 504) of each pair515 a, 515 b.

In some embodiments, the respective value of the predetermined parameterD1-D8 of the first tile (e.g. tile 501, tile 503) of each pair 515 a,515 b can be greater than a nominal value of the predetermined parameterD1-D8, and the respective value of the predetermined parameter D1-D8 ofthe second tile (e.g. tile 502, tile 504) of each pair 515 a, 515 b canbe less than the nominal value of the predetermined parameter D1-D8.

In some embodiments, the method can further include identifying a firstset of tiles and a second set of tiles. The respective value of thepredetermined parameter D1-D8 of each tile of the first set of tiles canbe greater than a nominal value of the predetermined parameter D1-D8 andthe respective value of the predetermined parameter D1-D8 of each tileof the second set of tiles can be less than the nominal value of thepredetermined parameter D1-D8. In some embodiments, the first tile(e.g., tile 501, tile 503) of each pair of tiles 515 a, 515 b can beselected from the first set of tiles, and the second tile (e.g. tile502, tile 504) of each pair of tiles 515 a, 515 b can be selected fromthe second set of tiles.

In some embodiments, the method can further include ordering the firstset of tiles in ascending order or descending order based on therespective value of the predetermined parameter D1-D8 of each tile ofthe first set of tiles, and ordering the second set of tiles inascending order or descending order based on the respective value of thepredetermined parameter D1-D8 of each tile of the second set of tiles.The first tile (e.g., tile 501, tile 503) of each pair of tiles 515 a,515 b can be sequentially selected from the first set of ordered tilesand the second tile (e.g., tile 502, tile 504) of each pair of tiles 515a, 515 b can be sequentially selected from the second set of orderedtiles.

A computer simulation was performed by selecting the tiles according tothe third tiling strategy based on the value of the predeterminedparameter D2 in accordance with methods of the disclosure. For example,tiles were selected based on the respective value of the predeterminedparameter D2 where deviations of the tiles relative to a nominal tilecan cancel each other. Likewise, in some embodiments, one or more tilescan be selected based on a respective value of two or more predeterminedparameters D1-D8 where deviations of the two or more predeterminedparameters D1-D8 of the one or more tiles relative to a nominal tile cancancel each other.

TABLE 54 provides failure rates of the computer simulations employingthe third tiling strategy with respect to 50 micrometer lateral offsettiles employing a global positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 54 50 Micrometer Lateral Offset - Tiling Strategy 3 GlobalPosition Method Registration Pitch × Pixel Pitch 1.5× 1.1× 1.01× Array —703a 703b  5 × 5 0.000009 0.000207 0.000500  6 × 6 0.000007 0.0002270.000628  7 × 7 0.000014 0.000358 0.000879  8 × 8 0.000017 0.0005030.001179  9 × 9 0.000020 0.000581 0.001433 10 × 10 0.000026 0.0007070.001791

Additionally, FIG. 8 illustrates an exemplary plot based on thesimulated assembly of the third tiling strategy of TABLE 54. Inparticular, line 703 a represents the respective failure rates for thevarious arrays with respect to a registration pitch of 1.1 times thepixel pitch for the 50 micrometer offset tiles assembled with the globalpositioning method employing the third tiling strategy, and line 703 brepresents the respective failure rates for the various arrays withrespect to a registration pitch of 1.01 times the pixel pitch for the 50micrometer offset tiles assembled with the global positioning methodemploying the third tiling strategy.

TABLE 55 provides failure rates of the computer simulations employingthe third tiling strategy with respect to 50 micrometer lateral offsettiles employing a relative positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 55 50 Micrometer Lateral Offset - Tiling Strategy 3 RelativePosition Method Registration Pitch × Pixel Pitch 1.5× 1.1× 1.01× Array —703c 703d  5 × 5 0.000008 0.000193 0.000524  6 × 6 0.000009 0.0003040.000695  7 × 7 0.000010 0.000364 0.000930  8 × 8 0.000021 0.0004720.001138  9 × 9 0.000020 0.000587 0.001467 10 × 10 0.000036 0.0007500.001833

Additionally, FIG. 9 illustrates an exemplary plot based on thesimulated assembly of the third tiling strategy of TABLE 55. Inparticular, line 703 c represents the respective failure rates for thevarious arrays with respect to a registration pitch of 1.1 times thepixel pitch for the 50 micrometer offset tiles assembled with therelative positioning method employing the third tiling strategy, andline 703 d represents the respective failure rates for the variousarrays with respect to a registration pitch of 1.01 times the pixelpitch for the 50 micrometer offset tiles assembled with the relativepositioning method employing the third tiling strategy.

TABLE 56 provides failure rates of the computer simulations employingthe third tiling strategy with respect to 100 micrometer lateral offsettiles employing a global positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 56 100 Micrometer Lateral Offset - Tiling Strategy 3 GlobalPosition Method Registration Pitch × Pixel Pitch 1.5× 1.1× 1.01× Array —706a 706b  5 × 5 0.000057 0.003823 0.013258  6 × 6 0.000093 0.0053310.018352  7 × 7 0.000091 0.006995 0.024065  8 × 8 0.000133 0.0089470.030818  9 × 9 0.000182 0.011025 0.038116 10 × 10 0.000204 0.0139150.047256

Additionally, FIG. 10 illustrates an exemplary plot based on thesimulated assembly of the third tiling strategy of TABLE 56. Inparticular, line 706 a represents the respective failure rates for thevarious arrays with respect to a registration pitch of 1.1 times thepixel pitch for the 100 micrometer offset tiles assembled with theglobal positioning method employing the third tiling strategy, and line706 b represents the respective failure rates for the various arrayswith respect to a registration pitch of 1.01 times the pixel pitch forthe 100 micrometer offset tiles assembled with the global positioningmethod employing the third tiling strategy.

TABLE 57 provides failure rates of the computer simulations employingthe third tiling strategy with respect to 100 micrometer lateral offsettiles employing a relative positioning method positioning tiles into 5×5arrays, 6×6 arrays, 7×7 arrays, 8×8 arrays, 9×9 arrays, and 10×10 arrayswith registration pitches of 1.5 times the pixel pitch, 1.1 times thepixel pitch, and 1.01 times the pixel pitch.

TABLE 57 100 Micrometer Lateral Offset - Tiling Strategy 3 RelativePosition Method Registration Pitch × Pixel Pitch 1.5× 1.1× 1.01× Array —706c 706d  5 × 5 0.000046 0.003847 0.013260  6 × 6 0.000080 0.0052160.017989  7 × 7 0.000093 0.007059 0.023898  8 × 8 0.000146 0.0092600.030637  9 × 9 0.000174 0.011450 0.038313 10 × 10 0.000195 0.0138200.046269

Additionally, FIG. 11 illustrates an exemplary plot based on thesimulated assembly of the third tiling strategy of TABLE 57. Inparticular, line 706 c represents the respective failure rates for thevarious arrays with respect to a registration pitch of 1.1 times thepixel pitch for the 100 micrometer offset tiles assembled with therelative positioning method employing the third tiling strategy, andline 706 d represents the respective failure rates for the variousarrays with respect to a registration pitch of 1.01 times the pixelpitch for the 100 micrometer offset tiles assembled with the relativepositioning method employing the third tiling strategy.

With respect to the third tiling strategy, as noted, it was hypothesizedthat failure rates of the display areas could be reduced by employingthe third tiling strategy relative to the first tiling strategy.Additionally, the third tiling strategy can be employed to position aplurality of tiles throughout the display area as well as to position aplurality of tiles in one or more predetermined regions (e.g.,perimeter, corners, central region) of the display area. As provided inFIGS. 8-11, it can be seen that respective failure rates of the thirdtiling strategy (e.g., lines 703 a, 703 b, 703 c, 703 d, and lines 706a, 706 b, 706 c, 706 d) decreased relative to the first tiling strategy(e.g., lines 701 a, 701 b, 701 c, 701 d, and lines 704 a, 704 b, 704 c,704 d). Therefore, in some embodiments, the third tiling strategy canproduce lower failure rates than the first tiling strategy. Accordingly,in some embodiments, assembling a display area including a plurality oftiles including a plurality of microLEDs defining a plurality of pixelsin accordance with embodiments of the disclosure can provide severaladvantages with respect to reducing failure rates of the display area ofa display device.

Moreover, in some embodiments, an exemplary variation of one or more ofthe first, second, or third tiling strategies can include modifying(e.g., truncating) the plurality of tiles by, for example, removing oneor more tiles that are not within a predetermined standard deviation(e.g., 6-sigma, 3-sigma) of a numerical distribution of the values ofthe predetermined parameters D1-D8 from the plurality of tiles.Accordingly, in some embodiments, after removing the one or more tiles,tiles can be selected from the modified plurality of tiles in accordancewith one or more of the first, second, or third tiling strategieswithout departing from the scope of the disclosure. Likewise, in someembodiments, selecting a tile based on a value of the predeterminedparameters D1-D8 can be based on a single predetermined parameter or acombination of one or more predetermined parameters D1-D8.

It should be understood that while various embodiments have beendescribed in detail with respect to certain illustrative and specificembodiments thereof, the present disclosure should not be consideredlimited to such, as numerous modifications and combinations of thedisclosed features are possible without departing from the scope of thefollowing claims.

1. A method of assembling a display area comprising: selecting a firsttile from a plurality of tiles, each tile of the plurality of tilescomprising a predetermined parameter and a plurality of microLEDsdefining a plurality of pixels, the selecting the first tile based on avalue of the predetermined parameter of the first tile; selecting asecond tile from the plurality of tiles based on a value of thepredetermined parameter of the second tile; and positioning the firsttile and the second tile into an array defining at least a portion ofthe display area, a first edge of the first tile facing a second edge ofthe second tile.
 2. The method of claim 1, wherein the value of thepredetermined parameter of the first tile is greater than a nominalvalue of the predetermined parameter, and the value of the predeterminedparameter of the second tile is less than the nominal value of thepredetermined parameter.
 3. The method of claim 1, wherein the value ofthe predetermined parameter of the first tile defines a greatest valueof the predetermined parameters of the plurality of tiles relative to anominal value of the predetermined parameter, and the value of thepredetermined parameter of the second tile defines a smallest value ofthe predetermined parameters of the plurality of tiles relative to thenominal value of the predetermined parameter.
 4. The method of claim 1,further comprising sorting the plurality of tiles based on a respectivevalue of the predetermined parameter of the plurality of tiles.
 5. Themethod of claim 4, wherein the sorting comprises identifying a first setof tiles and a second set of tiles, the respective value of thepredetermined parameter of each tile of the first set of tiles isgreater than a nominal value of the predetermined parameter, and therespective value of the predetermined parameter of each tile of thesecond set of tiles is less than the nominal value of the predeterminedparameter.
 6. The method of claim 5, further comprising ordering thefirst set of tiles in ascending order or descending order based on therespective value of the predetermined parameter of each tile of thefirst set of tiles, and ordering the second set of tiles in ascendingorder or descending order based on the respective value of thepredetermined parameter of each tile of the second set of tiles.
 7. Themethod of claim 5, wherein the first tile is selected from the first setof tiles and the second tile is selected from the second set of tiles.8. The method of claim 7, wherein the value of the predeterminedparameter of the first tile defines a greatest value of thepredetermined parameters of the first set of tiles relative to thenominal value of the predetermined parameter, and the value of thepredetermined parameter of the second tile defines a smallest value ofthe predetermined parameters of the second set of tiles relative to thenominal value of the predetermined parameter.
 9. The method of claim 1,further comprising selecting at least one additional tile from theplurality of tiles based on a value of the predetermined parameter ofthe at least one additional tile and positioning the at least oneadditional tile into the array.
 10. The method of claim 1, wherein thepredetermined parameter of each tile of the plurality of tiles comprisesat least one of a respective lateral dimension of each tile of theplurality of tiles, a respective edge straightness of each tile of theplurality of tiles, and a respective squareness of each tile of theplurality of tiles.
 11. A display device comprising the display areaassembled by the method of claim 1, wherein a lateral distance betweenimmediately adjacent pixels of the plurality of pixels defines a pixelpitch, a lateral distance between at least one first outer pixel of thefirst tile spaced from the first edge of the first tile and at least onesecond outer pixel of the second tile spaced from the second edge of thesecond tile defines a registration pitch, and the registration pitch isless than or equal to about 1.5 times the pixel pitch.
 12. The displaydevice of claim 11, wherein the registration pitch is less than or equalto about 1.1 times the pixel pitch.
 13. The display device of claim 11,wherein the registration pitch is less than or equal to about 1.01 timesthe pixel pitch.
 14. The display device of claim 11, wherein the pixelpitch is from about 100 micrometers to about 500 micrometers.
 15. Amethod of assembling a display area comprising: selecting a plurality ofpairs of tiles from a plurality of tiles, each tile of the plurality oftiles comprising a predetermined parameter and a plurality of microLEDsdefining a plurality of pixels, the selecting the plurality of pairs oftiles based on a respective value of the predetermined parameter of eachtile of the plurality of tiles, each pair of tiles comprising a firsttile and a second tile, the respective value of the predeterminedparameter of the first tile of each pair of tiles is greater than therespective value of the predetermined parameter of the second tile ofeach pair of tiles; and positioning the plurality of pairs of tiles intoan array defining at least a portion of the display area, a respectivefirst edge of the first tile of each pair of tiles facing a respectivesecond edge of the second tile of each pair of tiles.
 16. The method ofclaim 15, wherein the respective value of the predetermined parameter ofthe first tile of each pair of tiles is greater than a nominal value ofthe predetermined parameter, and the respective value of thepredetermined parameter of the second tile of each pair of the tiles isless than the nominal value of the predetermined parameter.
 17. Themethod of claim 15, further comprising identifying a first set of tilesfrom the plurality of tiles and identifying a second set of tiles fromthe plurality of tiles, wherein the respective value of thepredetermined parameter of each tile of the first set of tiles isgreater than a nominal value of the predetermined parameter, therespective value of the predetermined parameter of each tile of thesecond set of tiles is less than the nominal value of the predeterminedparameter, the first tile of each pair of tiles selected from the firstset of tiles, and the second tile of each pair of tiles selected fromthe second set of tiles.
 18. The method of claim 17, further comprisingordering the first set of tiles in ascending order or descending orderbased on the respective value of the predetermined parameter of eachtile of the first set of tiles, and ordering the second set of tiles inascending order or descending order based on the respective value of thepredetermined parameter of each tile of the second set of tiles, thefirst tile of each pair of tiles sequentially selected from the firstset of ordered tiles and the second tile of each pair of tilessequentially selected from the second set of ordered tiles.
 19. Themethod of claim 15, wherein the predetermined parameter of each tile ofthe plurality of tiles comprises at least one of a respective lateraldimension of each tile of the plurality of tiles, a respective edgestraightness of each tile of the plurality of tiles, and a respectivesquareness of each tile of the plurality of tiles.
 20. A display devicecomprising the display area assembled by the method of claim 15, whereina lateral distance between immediately adjacent pixels of the pluralityof pixels defines a pixel pitch from about 100 micrometers to about 500micrometers.